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Semiconductor Manufacturing Process Monitor
DIGI Series
Integrated management with an in-situ real time monitor
“DIGI Series” for next-generation thin-film processes
Outline
Real time monitoring of film thickness, trench depth, and plasma is conducted to increase the yield rate with state-of-the-art etching and coating, with management and control now considered essential during this process. The DIGI Series makes use of advanced measurement technologies created by HORIBA JOBIN YVON in France, the leading company in optics development.
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