Full Automatic Ultra Thin Film Analyzer
UT-300
For fully-automated measurement of a broad range of films, from 1 nm ultra-thin film to complex multilayer structures
HORIBA JOBIN YVON's Spectroscopic Ellipsometry is now combined with HORIBA's full automatic wafer handling system
With the constantly increasing integration of semiconductors and liquid crystal panels, related manufacturing processes present a growing need for evaluation and analysis of ultra-thin SiO2, and complex multilayer structures. Conventional instruments are no longer appropriate, since they are not accurate enough for today's thin films, and they cannot measure various characteristics of multilayer films in a single operation. However, we have developed a comprehensive evaluation and analysis solution by combining the Spectroscopic Ellipsometry of HORIBA JOBIN YVON (a HORIBA group company) with HORIBA's proprietary transfer technology in the UT-300, a fully-automated measuring system developed for ultra-thin films. The new system is capable of measuring the thickness (d) and optical constants (n, k) of complex and multilayer films and ultra-thin SiO2 films simultaneously. In short, the UT-300 can provide the process control solutions to meet specific needs of production.
Advanced performance for advanced measuring needs
 PEM * element without mechanical vibration obtains fast and accurate measurements Unlike competitors' systems, HORIBA JOBIN YVON's Spectroscopic Ellipsometer uses phase modulation based on the PEM element. This enables fast and highly accurate measurements, characterized by limited susceptibility to the effects of light, as well as the complete absence of mechanical vibration.
* PEM = Photoelastic modulator
From 1 nm ultra-thin films to multilayer films for flush memory devices The system allows thin film measurement and data analysis over a broad range of wavelengths - short-wave to long-wave applications - from approximately 190 nm to 830 nm (typical: 248 nm to 830 nm).
*Option
Fast (100 ms) and highly sensitive measurement
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The multi-wavelengths simultaneous measurement unit incorporates photomultipliers to enable measurements of high sensitivity and minimum measuring time of 100 ms.
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* Multi-wavelengths simultaneous measurement unit
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Next-generation system design and specifications
Flexible enough to support cutting-edge technology and state-of-the art automated lines The UT-300 can be combined with DUV reflection reducing coat and other cutting-edge technologies. It can also be installed in advanced automated lines by using the optional SECS/GEM interface, designed for LAN, AGV, and SMIF/300 mm FOUP.
Accepts 12-, 8-, and 6-inch wafer sizes A single system can handle both 12- and 8- inch wafer sizes. Systems for 6- inch wafers are also available.
Easy operation and functions designed to meet production needs
Easy operation and detailed setting options Normal operation can be done easily with minimum skills and experience. However, customized setting options allow detailed setting by the engineer.
Software enables fully automated analysis of complex and multilayer films The system is equipped with software for fully automated measurement and analysis of physical properties - such thickness uniformity and optical indexes for each layer.
Fully automated evaluation enables continuous measurement The system is equipped with a highly accurate pattern recognition function, designed for fully automated evaluation at measuring points.
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