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Full Automatic Ultra Thin Film Analyzer
UT-300
Measurement specification
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Repeatability:
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± 0.1 nm at 10 nm SiO2 NIST
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± 0.25 nm at 50 nm SiO2 NIST
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± 0.25 nm at 100 nm SiO2 NIST
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± 0.15 percent at 200 nm SiO2 NIST
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System specification
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Wavelength:
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Standard spec: 248 to 830 nm
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Option spec: 190 to 830 nm
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Light source:
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Xe lamp
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Sample stage
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Wafer size;
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Standard wafer size: 300 mm and 200 mm
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Option wafer size: 5 inch, 6 inch
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Stage resolution;
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Less than 1 µm
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Multichannel:
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Standard: 16 ch
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Option: 32 ch, 64 ch,
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Pattern recognition:
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Standard
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Auto focus:
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Standard
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Communication:
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Option (SECS2, GEM)
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Option (CIM, AGV)
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Utility of power:
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Standard:
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200 V AC ± 10 percent, 3 KVA,
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50 and 60 Hz ± 1 percent
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Option:
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208, 220, 230, 240 V AC
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Utility of vacuum,
pressure air and gas:
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Vacuum: 20 ± 5 Kpa (flow rate: depends on stage spec)
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Air: 0.5 ± 0.05 Mpa (flow rate: depends on robot spec)
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N2: approx. 4 L/min
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Exhaust:
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Diameter of duct: 100 mm
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Flow rate: 50 m3 /hour
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